Dimensions: 53*53*10.5mm(length * width * height).
Support platform: Intel the LGA / 1150/1151/1155/1156/2011/2011-775/1366 v3, AMD SocketFM1 / FM2 / FM2 + / AM2 / AM2 + / AM3 AM3 + / AM4 (part of the platform need to change or fixture screw).
It is recommended to use the special heat conduction fluid of Syscooling brand.
All metal design, high strength, good heat resistance, suitable for a variety of environments, durable and reliable.
High purity copper base, higher thermal conductivity, faster heat removal.
Square cylindrical channel design, effectively increase the liquid contact area, improve the heat transfer efficiency.
Standard g1/4 threaded nozzle, suitable for quick twist or pagoda head.
High quality sealing process, factory through 3 air tightness detection, safety and leakage prevention, more reliable.